SIP – MITSUDELL

TM2104/5/6 LGA-10x12mm-10L

2.4GHz RF transceiver SiP IC with 2Mbps (package type option)

High power out GFSK transceiver operating in the world wide ISM frequency band at 2400~2483.5 MHz.
Burst mode transmission and up to 2Mbps air data rate make them suitable for applications requiring ultra low power consumption.
Embedded packet processing engines enable their full operation with a very simple MCU as a radio system.
Auto re-transmission and auto acknowledge give reliable link without any MCU interference.
Operates in TDD mode, either as a transmitter or as a receiver.
RF channel frequency determines the center of the channel used by TM2104.
Frequency is set by the RF_CH register in register bank 0 according to the following formula: F0=2400+RF_CH (MHz).
Resolution of the RF channel frequency is 1MHz.
A transmitter and a receiver must be programmed with the same RF channel frequency to be able to communicate with each other.
Output power of the IC is set by the RF_PWR bits in the RF_SETUP register.
Demodulation is done with embedded data slicer and bit recovery logic.
Air data rate can be programmed to 1Mbps or 2Mbps by RF_DR register.
Transmitter and a receiver must be programmed with the same setting.
Registers are in register bank 0 except with explicit claim.

TM2100 (Ginseng) LGA-6×16.3-64L

2.4GHz Wireless Audio SiP

IC Packaging in 6x16mm, including 8-thread MCU, Power Amplifier, RF switch, EEPROM 512K, and RF Transceiver with 2Mbps data rate.
Built on a BT substrate with bottom side GNDs for RF and thermal
MSL-3
Designed for wireless Audio
Loaded in the memory of MCU and EEPROM
Create 1 to 4 bond wireless link with 16bits/48K sampling arte
Latency is very short <36ms under 1 to 4 application
In pro mode, the latency is <18ms, good for gaming applications

TM2102 (Saffron) LGA-5x15mm-64L

2.4GHz Wireless Audio SiP

Packaging in 5x15mm, including 8-thread MCU, Power Amplifier, RF switch, EEPROM 256K, and Transceiver with 2Mbps data rate
Built on a BT substrate with bottom side GNDs for RF and Thermal
MSL-3
Designed for wireless Audio
Loaded in the memory of MCU and EEPROM
Creates 12 to 4 bond wireless link with 16bits/48K sampling rate
Latency is very short <36ms under 1 to 4 application
In pro mode, latency is <18ms, good for gaming applications

TM2110 (Octavia) LGA-6x16mm-64L

2.4GHz Wireless Audio SiP

Low cost SiP packaging in 12x12mm, including 8-thread MCU, Power Amplified, EEPROM 256K, and RF Transceiver with 2Mbps data rate.
Built on a BT substrate with bottom side GNDs for RF and Thermal
MSL-3
Designed for wireless audio
Loaded in the memory of MCU and EEPROM
Create 1 to 4 bond wireless link with 16bits/48K sampling rate
Latency is short <36ms under 1 to 4 application
In Pro mode, latency is <18ms, good for gaming applications

TM2022 QFN-14x14mm-48L

5.8GHz Electronics Toll Collection (ETC) SiP

Multi-Lane Free Flow (MLFF)

IC aimed at solving the requires for multi-lane free flow ETC.
Uses 5.8GHz frequency for world wide applications
Include RF ASK Transcevier with 256/512K data rate, IC card reader with ISO 14443 A/B and Filica and Cortex M3 MCU with 72MIPs speed
Current consumption lower than 10Ua while the IC in sleep mode
Wakeup function provides a 14K Hz signal to wakeup MCU within 3 MS and the IC will be switch to Rx mode
Packaged on a lead less QFN-48L type substarte uses multi-chip process
Qualified as MSL-3 standard

TM2110 (Octavia)

2.4GHz Wireless Audio SiP

Packaging in 6x16mm, including 8-thread MCU, Power Amplifier, RF Switch, EEPROM 256K, and RF Transceiver with 2Mbps data rate.
Built on a BT substrate with bottom side GNDs for RF and Thermal
MSL-3
Designed for wireless audio
Create 1 to 4 bond wireless link with 16bits/48K sampling rate
Latency very short <36ms under 1 to 4 application
In pro mode, latency is <18ms, good for gaming applications

TM2115 (AR801) QFN20x20mm-48L

2.4GHz Audio module with 24bits/48K Sampling Rate Audio Sip IC (AR801)

Wireless audio IC including 2.4GHz RF transceiver, Codec, and MCU with one I2S interface.

Features :

5 or 2 Mbps over the air data rate
Bandwidth efficient modulation format
Excellent link budget with programmable output power up to +11/17dBm and -87/90dBm sensitivity.

Applications :

TM2124 Nadja-L

2.4GHz Audio SiP with dual operation system

Packaging in 6x16mm, including two 8-thread MCUs, RF switch, 2 Flash memory 512K, and RF Transceiver with 2Mbps/4Mbps data rate
Built on a BT substrate with bottom side GNDs for RF and Thermal
MSL-3
Designed for wireless audio
Loaded in the memory of MCU and Flash
Creates 1 to 4 bond wireless link with 16bits/48K sampling rate
Latency very short <36ms under 1 to 4 application
In pro mode, latency is <18ms, good for gaming applications.

TM2502/3/4

5.8GHz FSK/GFSK Transceiver IS with 4Mbps with 5dBm/18dBm/23dBm (option)

Include Power amplifier, Low noise amplifier, RF switch and a 4Mbps RF transceiver
Bottom side has Thermal GND
Stamp and leadless type pin pad for easier soldering
Suitable for applications requiring ultra low power consumption
Embedded packet processing engines enable their full operation with very simple MCU as a radio system
Auto re-transmission and auto acknowledgement give reliable link without any MCU interference
Operates in TDD mode, either as a transmitter or receiver
frequency is set by the RF_CH register in register bank 0 according to the following formula: F0=5150+RF_CH (MHz)
RF channel frequency is 1MHz
Transmitter and receiver must be programmed with the same RF channel frequency to be able to communicate with each other
Output power of TM2502 is set by the RF_PWR bits in the RF_SETUP register
Demodulation is done with embedded data slicer and bit recovery logic
Air data rate can be programmable to 4Mbps by RF_DR register
Transmitter and receiver must be programmed in same setting
All register are in register bank 0 except with explicit claim

TM2114 LGA-10x12mm-10L

2.4GHz RF transceiver SiP IC with 4 Mbps data rate

High performance RF SiP IC, ultra small package, low price

Features :

Applications :